Chapter 1. Research Scope
1.1. Research Objectives
1.2. Market Definition
1.3. Analysis Period
1.4. Market Size Breakdown by Segments
1.4.1. Market size breakdown, by component
1.4.2. Market size breakdown, by material
1.4.3. Market size breakdown, by technology
1.4.4. Market size breakdown, by frequency band
1.4.5. Market size breakdown, by application
1.4.6. Market size breakdown, by region
1.4.7. Market size breakdown, by country
1.5. Market Data Reporting Unit
1.5.1. Value
1.6. Key Stakeholders
Chapter 2. Research Methodology
2.1. Secondary Research
2.1.1. Paid
2.1.2. Unpaid
2.1.3. P&S Intelligence database
2.2. Primary Research
2.3. Market Size Estimation
2.4. Data Triangulation
2.5. Currency Conversion Rates
2.6. Assumptions for the Study
2.7. Notes and Caveats
Chapter 3. Executive Summary
Chapter 4. Voice of Industry Experts/KOLs
Chapter 5. Market Indicators
Chapter 6. Industry Outlook
6.1. Market Dynamics
6.1.1. Trends
6.1.2. Drivers
6.1.3. Restraints/challenges
6.1.4. Impact analysis of drivers/restraints
6.2. Impact of COVID-19
6.3. Porter’s Five Forces Analysis
6.3.1. Bargaining power of buyers
6.3.2. Bargaining power of suppliers
6.3.3. Threat of new entrants
6.3.4. Intensity of rivalry
6.3.5. Threat of substitutes
Chapter 7. Global Market
7.1. Overview
7.2. Market Revenue, by Component (2017–2030)
7.3. Market Revenue, by Material (2017–2030)
7.4. Market Revenue, by Technology (2017–2030)
7.5. Market Revenue, by Frequency Band (2017–2030)
7.6. Market Revenue, by Application (2017–2030)
7.7. Market Revenue, by Region (2017–2030)
Chapter 8. North America Market
8.1. Overview
8.2. Market Revenue, by Component (2017–2030)
8.3. Market Revenue, by Material (2017–2030)
8.4. Market Revenue, by Technology (2017–2030)
8.5. Market Revenue, by Frequency Band (2017–2030)
8.6. Market Revenue, by Application (2017–2030)
8.7. Market Revenue, by Country (2017–2030)
Chapter 9. Europe Market
9.1. Overview
9.2. Market Revenue, by Component (2017–2030)
9.3. Market Revenue, by Material (2017–2030)
9.4. Market Revenue, by Technology (2017–2030)
9.5. Market Revenue, by Frequency Band (2017–2030)
9.6. Market Revenue, by Application (2017–2030)
9.7. Market Revenue, by Country (2017–2030)
Chapter 10. APAC Market
10.1. Overview
10.2. Market Revenue, by Component (2017–2030)
10.3. Market Revenue, by Material (2017–2030)
10.4. Market Revenue, by Technology (2017–2030)
10.5. Market Revenue, by Frequency Band (2017–2030)
10.6. Market Revenue, by Application (2017–2030)
10.7. Market Revenue, by Country (2017–2030)
Chapter 11. LATAM Market
11.1. Overview
11.2. Market Revenue, by Component (2017–2030)
11.3. Market Revenue, by Material (2017–2030)
11.4. Market Revenue, by Technology (2017–2030)
11.5. Market Revenue, by Frequency Band (2017–2030)
11.6. Market Revenue, by Application (2017–2030)
11.7. Market Revenue, by Country (2017–2030)
Chapter 12. MEA Market
12.1. Overview
12.2. Market Revenue, by Component (2017–2030)
12.3. Market Revenue, by Material (2017–2030)
12.4. Market Revenue, by Technology (2017–2030)
12.5. Market Revenue, by Frequency Band (2017–2030)
12.6. Market Revenue, by Application (2017–2030)
12.7. Market Revenue, by Country (2017–2030)
Chapter 13. U.S. Market
13.1. Overview
13.2. Market Revenue, by Component (2017–2030)
13.3. Market Revenue, by Material (2017–2030)
13.4. Market Revenue, by Technology (2017–2030)
13.5. Market Revenue, by Frequency Band (2017–2030)
13.6. Market Revenue, by Application (2017–2030)
Chapter 14. Canada Market
14.1. Overview
14.2. Market Revenue, by Component (2017–2030)
14.3. Market Revenue, by Material (2017–2030)
14.4. Market Revenue, by Technology (2017–2030)
14.5. Market Revenue, by Frequency Band (2017–2030)
14.6. Market Revenue, by Application (2017–2030)
Chapter 15. Germany Market
15.1. Overview
15.2. Market Revenue, by Component (2017–2030)
15.3. Market Revenue, by Material (2017–2030)
15.4. Market Revenue, by Technology (2017–2030)
15.5. Market Revenue, by Frequency Band (2017–2030)
15.6. Market Revenue, by Application (2017–2030)
Chapter 16. France Market
16.1. Overview
16.2. Market Revenue, by Component (2017–2030)
16.3. Market Revenue, by Material (2017–2030)
16.4. Market Revenue, by Technology (2017–2030)
16.5. Market Revenue, by Frequency Band (2017–2030)
16.6. Market Revenue, by Application (2017–2030)
Chapter 17. U.K. Market
17.1. Overview
17.2. Market Revenue, by Component (2017–2030)
17.3. Market Revenue, by Material (2017–2030)
17.4. Market Revenue, by Technology (2017–2030)
17.5. Market Revenue, by Frequency Band (2017–2030)
17.6. Market Revenue, by Application (2017–2030)
Chapter 18. Italy Market
18.1. Overview
18.2. Market Revenue, by Component (2017–2030)
18.3. Market Revenue, by Material (2017–2030)
18.4. Market Revenue, by Technology (2017–2030)
18.5. Market Revenue, by Frequency Band (2017–2030)
18.6. Market Revenue, by Application (2017–2030)
Chapter 19. Spain Market
19.1. Overview
19.2. Market Revenue, by Component (2017–2030)
19.3. Market Revenue, by Material (2017–2030)
19.4. Market Revenue, by Technology (2017–2030)
19.5. Market Revenue, by Frequency Band (2017–2030)
19.6. Market Revenue, by Application (2017–2030)
Chapter 20. Japan Market
20.1. Overview
20.2. Market Revenue, by Component (2017–2030)
20.3. Market Revenue, by Material (2017–2030)
20.4. Market Revenue, by Technology (2017–2030)
20.5. Market Revenue, by Frequency Band (2017–2030)
20.6. Market Revenue, by Application (2017–2030)
Chapter 21. China Market
21.1. Overview
21.2. Market Revenue, by Component (2017–2030)
21.3. Market Revenue, by Material (2017–2030)
21.4. Market Revenue, by Technology (2017–2030)
21.5. Market Revenue, by Frequency Band (2017–2030)
21.6. Market Revenue, by Application (2017–2030)
Chapter 22. India Market
22.1. Overview
22.2. Market Revenue, by Component (2017–2030)
22.3. Market Revenue, by Material (2017–2030)
22.4. Market Revenue, by Technology (2017–2030)
22.5. Market Revenue, by Frequency Band (2017–2030)
22.6. Market Revenue, by Application (2017–2030)
Chapter 23. Australia Market
23.1. Overview
23.2. Market Revenue, by Component (2017–2030)
23.3. Market Revenue, by Material (2017–2030)
23.4. Market Revenue, by Technology (2017–2030)
23.5. Market Revenue, by Frequency Band (2017–2030)
23.6. Market Revenue, by Application (2017–2030)
Chapter 24. South Korea Market
24.1. Overview
24.2. Market Revenue, by Component (2017–2030)
24.3. Market Revenue, by Material (2017–2030)
24.4. Market Revenue, by Technology (2017–2030)
24.5. Market Revenue, by Frequency Band (2017–2030)
24.6. Market Revenue, by Application (2017–2030)
Chapter 25. Brazil Market
25.1. Overview
25.2. Market Revenue, by Component (2017–2030)
25.3. Market Revenue, by Material (2017–2030)
25.4. Market Revenue, by Technology (2017–2030)
25.5. Market Revenue, by Frequency Band (2017–2030)
25.6. Market Revenue, by Application (2017–2030)
Chapter 26. Mexico Market
26.1. Overview
26.2. Market Revenue, by Component (2017–2030)
26.3. Market Revenue, by Material (2017–2030)
26.4. Market Revenue, by Technology (2017–2030)
26.5. Market Revenue, by Frequency Band (2017–2030)
26.6. Market Revenue, by Application (2017–2030)
Chapter 27. Saudi Arabia Market
27.1. Overview
27.2. Market Revenue, by Component (2017–2030)
27.3. Market Revenue, by Material (2017–2030)
27.4. Market Revenue, by Technology (2017–2030)
27.5. Market Revenue, by Frequency Band (2017–2030)
27.6. Market Revenue, by Application (2017–2030)
Chapter 28. South Africa Market
28.1. Overview
28.2. Market Revenue, by Component (2017–2030)
28.3. Market Revenue, by Material (2017–2030)
28.4. Market Revenue, by Technology (2017–2030)
28.5. Market Revenue, by Frequency Band (2017–2030)
28.6. Market Revenue, by Application (2017–2030)
Chapter 29. U.A.E. Market
29.1. Overview
29.2. Market Revenue, by Component (2017–2030)
29.3. Market Revenue, by Material (2017–2030)
29.4. Market Revenue, by Technology (2017–2030)
29.5. Market Revenue, by Frequency Band (2017–2030)
29.6. Market Revenue, by Application (2017–2030)
Chapter 30. Competitive Landscape
30.1. List of Market Players and their Offerings
30.2. Competitive Benchmarking of Key Players
30.3. Product Benchmarking of Key Players
30.4. Recent Strategic Developments
Chapter 31. Company Profiles
31.1. Qorvo Inc.
31.1.1. Business overview
31.1.2. Product and service offerings
31.1.3. Key financial summary
31.2. MACOM Technology Solutions Holdings Inc.
31.2.1. Business overview
31.2.2. Product and service offerings
31.2.3. Key financial summary
31.3. Skyworks Solutions Inc.
31.3.1. Business overview
31.3.2. Product and service offerings
31.3.3. Key financial summary
31.4. NXP Semiconductors N.V.
31.4.1. Business overview
31.4.2. Product and service offerings
31.4.3. Key financial summary
31.5. Infineon Technologies AG
31.5.1. Business overview
31.5.2. Product and service offerings
31.5.3. Key financial summary
31.6. WIN Semiconductors Corp.
31.6.1. Business overview
31.6.2. Product and service offerings
31.6.3. Key financial summary
31.7. STMicroelectronics N.V.
31.7.1. Business overview
31.7.2. Product and service offerings
31.7.3. Key financial summary
31.8. ON Semiconductor Corporation
31.8.1. Business overview
31.8.2. Product and service offerings
31.8.3. Key financial summary
31.9. Aspen Electronics Ltd.
31.9.1. Business overview
31.9.2. Product and service offerings
31.10. VectraWave
31.10.1. Business overview
31.10.2. Product and service offerings
31.11. Analog Devices Inc.
31.11.1. Business overview
31.11.2. Product and service offerings
31.11.3. Key financial summary
31.12. United Monolithic Semiconductors Group
31.12.1. Business overview
31.12.2. Product and service offerings
31.13. Mini-Circuits
31.13.1. Business overview
31.13.2. Product and service offerings
31.14. Texas Instruments Incorporated
31.14.1. Business overview
31.14.2. Product and service offerings
31.14.3. Key financial summary
31.15. Mitsubishi Electric Corporation
31.15.1. Business overview
31.15.2. Product and service offerings
31.15.3. Key financial summary
Chapter 32. Appendix
32.1. Abbreviations
32.2. Sources and References
32.3. Related Reports
| ※参考情報 モノリシックマイクロ波IC(MMIC)は、高周波の信号処理を行うために設計された集積回路の一種です。MMICは、半導体材料を用いて作成され、微小なサイズで高性能を実現することが特徴です。この技術は、特に無線通信、レーダー、衛星通信、センサーなどの分野で広く利用されています。 MMICには、主に以下の二つの種類があります。一つは、受信機や送信機といった信号の処理を行うための機能を持つアナログMMICです。アナログMMICは、増幅器やミキサー、フィルターなど、さまざまな機能を統合しています。もう一つは、デジタル信号処理を行うためのデジタルMMICであり、データの変調や復調、エラー訂正などを行います。これらのMMICは、それぞれの用途に応じて設計されており、高周波数でも動作可能です。 MMICの主な用途は、通信分野において特に顕著です。携帯電話や無線LAN、衛星通信など、さまざまな無線通信システムで利用されています。これらのシステムでは高速なデータ伝送が求められるため、MMICの高性能な特性が活かされます。また、レーダーやミリ波技術にも利用され、航空機や防衛システムなどでの高精度な測定が可能です。さらに、 IoT(Internet of Things)や自動運転技術の発展に伴い、小型化や高集積化が進むことで、新たな市場が開拓されつつあります。 MMICの製造には、いくつかの関連技術があります。まず、半導体プロセス技術が重要です。これにより、トランジスタや抵抗、コンデンサなどの回路素子が微細化され、高集積度を実現します。さらに、化合物半導体材料、特にGaAs(ガリウムヒ素)やInP(リン化インジウム)がよく利用されます。これらの材料は高い電子移動度を持ち、高周波での動作特性が優れているため、MMICの性能向上に寄与しています。 もう一つの関連技術としては、マイクロ波回路設計手法があります。MMICの設計は、高周波信号の特性を理解し、最適な回路構成を決定することが求められます。回路シミュレーションツールを使って、周波数特性やインピーダンス整合などを精密に計算し、製品化に向けた設計プロセスを進めます。 MMIC技術の未来についても触れておくと、高周波数帯域の拡張や、多機能統合の進展が予想されます。特に5G通信の普及に伴い、より高速で広帯域な通信を実現するための技術革新が進むでしょう。また、量子通信や次世代レーダー技術など、新たなアプリケーションに対応するためのMMICの開発が期待されています。 このように、モノリシックマイクロ波IC(MMIC)は、電子機器の miniaturization の流れにおいて重要な役割を担っています。これまでの技術進歩により、MMICはさらに高機能化・高性能化し、多様な分野での応用が進むと考えられます。MMICは、その技術的優位性を生かし、これからも多くの産業において欠かせない存在となるでしょう。 |
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