メモリ半導体パッケージングのアジア市場規模・シェア・開発・成長・需要予測

調査会社P&S Market Research社が発行したリサーチレポート(データ管理コード:PSM804052)
◆英語タイトル:APAC Memory Packaging Market by Platform (Wire-Bond, Lead-Frame, Flip-Chip, TSV, WLCSP), by Application (DRAM Packaging, NAND Flash Packaging, NOR Flash Packaging, 3D TSV Packaging), by End-Use (Consumer Electronics, IT & Telecommunication, Embedded Systems, Automotive, Military & Aerospace, Medical Devices), by Geography (China, Japan, Taiwan, South Korea, India) - Market Size, Share, Development, Growth, and Demand Forecast, 2017-2023
◆発行会社/調査会社:P&S Market Research
◆商品コード:PSM804052
◆発行日:2018年3月
◆調査対象地域:アジア太平洋
◆産業分野:電子
◆ページ数:121
◆レポート言語:英語
◆レポート形式:PDF
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*** レポート概要(サマリー)***

Surge in investments in fabrication activities in China, rising demand for smartphones across the region, growing popularity of autonomous driving and in-car entertainment (ICE), and continuous improvements in high-bandwidth memory (HBM) and redistribution layer (RDL) are some of the major factors driving the growth of the APAC memory packaging market.
Insights on market segments

On the basis of packaging platform, the market has been categorized into wire-bond, lead-frame, flip-chip, through-silicon via (TSV), and wafer-level chip-scale packaging (WLCSP). Among these, the wire-bond packaging platform is estimated to contribute the largest revenue share, accounting for more than 75% to the APAC memory packaging market in 2017. Comprehensible program adjustments, easy changeovers, and low engineering costs are backing the demand for wire-bond memory packaging solutions. Even with changes in the package design, the wire-bond memory packaging platform continues to be used as the preferred interconnection platform because of its flexibility, low cost, and reliability.

China stands as the largest APAC memory packaging market

China is estimated to contribute the largest revenue share, accounting for more than 40% to the APAC memory packaging market in 2017. This can be mainly attributed to the broader application areas of memory packaging in various consumer electronics, particularly smartphones and tablets. Also, the presence of major memory packaging vendors in the China, such as Samsung Electronics Co. Ltd., SK hynix Inc., and Intel Corporation, is driving the memory packaging industry.

Increasing demand for smartphones is the key growth driver

Increasing demand for smartphones in APAC is one of the major factors driving the growth of the regional APAC memory packaging market. According to a recent study, the share of smartphone users in China was over 53.3% of the total mobile phone users in the country in 2016, which grew up to over 56% in 2017. With the rising adoption of smartphones, the use of packaged memory chips is also increasing.

The high adoption rate of smartphones in various APAC countries can also be attributed to the sleek aesthetic looks and advanced features of these smartphones. With advancements in memory packaging techniques, the size of smartphones is getting reduced. Effective space utilization offered by memory packaging technologies is one of the key factors propelling the growth of the APAC APAC memory packaging market.

Increasing investments in 3D NAND offers lucrative growth opportunities

With the rising prices of DRAM memory, vendors operating in the APAC memory packaging market are increasingly spending on the development of 3D NAND. According to an article published by SK hynix Inc., companies can no longer keep up with 3D NAND demand, and are required to expand their manufacturing capacity. Increasing spending on 3D NAND, complemented by its growing demand, is expected to create a huge growth opportunity for the players in the market in coming years.

APAC Memory Packaging Market Competitiveness

The APAC memory packaging market of APAC is witnessing many mergers and acquisitions among regional players. In the past few years, acquisitions have been one of the major inorganic growth strategies of the companies to increase their revenue share in the market. Companies such as Samsung Electronics Co. Ltd. and Micron Technology Inc. have been forerunners in acquiring and merging with small regional and adjacent technology-based market peers.

As part of growth strategy, various OSAT players are entering into strategic alliances with memory manufacturers, and regional players are joining hands with global technology providers to increase their reach in the market.

*** レポート目次(コンテンツ)***

Chapter 1. Research Background

1.1 Research Objectives

1.2 Market Definition

1.3 Research Scope

1.3.1 Market Segmentation by Platform

1.3.2 Market Segmentation by Application

1.3.3 Market Segmentation by End-Use

1.3.4 Market Segmentation by Country

1.3.5 Analysis Period

1.3.6 Market Data Reporting Unit

1.3.6.1 Value

1.4 Key Stakeholders

Chapter 2. Research Methodology

2.1 Secondary Research

2.2 Primary Research

2.2.1 Breakdown of Primary Research Respondents

2.2.1.1 By industry participant

2.2.1.2 By company type

2.3 Market Size Estimation

2.4 Data Triangulation

2.5 Assumptions for the Study

Chapter 3. Executive Summary

3.1 Battle for Market Share

Chapter 4. Introduction

4.1 Definition of Market Segments

4.1.1 By Platform

4.1.1.1 Wire-bond

4.1.1.2 Lead-frame

4.1.1.3 Flip-chip

4.1.1.4 TSV

4.1.1.5 WLCSP

4.1.2 By Application

4.1.2.1 DRAM packaging

4.1.2.2 NAND flash packaging

4.1.2.3 NOR flash packaging

4.1.2.4 3D TSV packaging

4.1.3 By End-Use

4.1.3.1 Consumer electronics

4.1.3.2 IT and telecommunication

4.1.3.3 Embedded systems

4.1.3.4 Automotive

4.1.3.5 Military and aerospace

4.1.3.6 Medical devices

4.1.3.7 Others

4.2 Advancements in Memory Packaging Technology

4.3 Market Dynamics

4.3.1 Trends

4.3.1.1 Shifting demand from DRAM to 3D TSV packaging technology

4.3.2 Drivers

4.3.2.1 Surge in fab investment activities in China

4.3.2.2 Increasing demand for smartphones

4.3.2.3 Growing popularity of autonomous driving and in-car entertainment (ICE)

4.3.2.4 High-bandwidth memory (HBM) and redistribution layer (RDL) improvements

4.3.2.5 Impact analysis of drivers on market forecast

4.3.3 Restraints

4.3.3.1 Thermal issues due to miniaturization of memory

4.3.3.2 Impact analysis of restraints on market forecast

4.3.4 Opportunities

4.3.4.1 Technological developments in multi-level fan-out wafer-level packaging (FOWLP)

4.3.4.2 Increasing spending on 3D NAND

4.4 Porter’s Five Forces Analysis

Chapter 5. Global Market Size and Forecast

Chapter 6. APAC Market Size and Forecast

6.1 By Platform

6.2 By Application

6.3 By End-Use

6.4 By Country

Chapter 7. Company Profiles

7.1 Apple Inc.

7.1.1 Business Overview

7.1.2 Product and Service Offerings

7.1.3 Key Financial Summary

7.1.4 Strategic Growth Plans

7.2 Dell EMC

7.2.1 Business Overview

7.2.2 Product and Service Offerings

7.2.3 Strategic Growth Plans

7.3 Qualcomm Technologies Inc.

7.3.1 Business Overview

7.3.2 Product and Service Offerings

7.3.3 Key Financial Summary

7.3.4 Strategic Growth Plans

7.4 International Business Machines Corporation (IBM)

7.4.1 Business Overview

7.4.2 Product and Service Offerings

7.4.3 Key Financial Summary

7.4.4 Strategic Growth Plans

7.5 Intel Corporation

7.5.1 Business Overview

7.5.2 Product and Service Offerings

7.5.3 Key Financial Summary

7.5.4 Strategic Growth Plans

7.6 Cisco Systems Inc.

7.6.1 Business Overview

7.6.2 Product and Service Offerings

7.6.3 Key Financial Summary

7.6.4 Strategic Growth Plans

7.7 Samsung Electronics Co. Ltd.

7.7.1 Business Overview

7.7.2 Product and Service Offerings

7.7.3 Key Financial Summary

7.7.4 Strategic Growth Plans

7.8 Winbond Electronics Corp.

7.8.1 Business Overview

7.8.2 Product and Service Offerings

7.8.3 Key Financial Summary

7.8.4 Strategic Growth Plans

7.9 Fujitsu Limited

7.9.1 Business Overview

7.9.2 Product and Service Offerings

7.9.3 Key Financial Summary

7.9.4 Strategic Growth Plans

7.1 LG Electronics Inc.

7.10.1 Business Overview

7.10.2 Product and Service Offerings

7.10.3 Key Financial Summary

7.10.4 Strategic Growth Plans

7.11 Toshiba Corporation

7.11.1 Business Overview

7.11.2 Product and Service Offerings

7.11.3 Key Financial Summary

7.11.4 Strategic Growth Plans

7.12 SK hynix Inc.

7.12.1 Business Overview

7.12.2 Product and Service Offerings

7.12.3 Key Financial Summary

7.12.4 Strategic Growth Plans

7.13 Nanya Technology Corporation

7.13.1 Business Overview

7.13.2 Product and Service Offerings

7.13.3 Key Financial Summary

7.13.4 Strategic Growth Plans

7.14 ASE Group

7.14.1 Business Overview

7.14.2 Product and Service Offerings

7.14.3 Key Financial Summary

7.14.4 Strategic Growth Plans

7.15 NEC Corporation

7.15.1 Business Overview

7.15.2 Product and Service Offerings

7.15.3 Key Financial Summary

7.15.4 Strategic Growth Plans

7.16 STMicroelectronics N.V.

7.16.1 Business Overview

7.16.2 Product and Service Offerings

7.16.3 Key Financial Summary

7.16.4 Strategic Growth Plans

7.17 Micron Technology Inc.

7.17.1 Business Overview

7.17.2 Product and Service Offerings

7.17.3 Key Financial Summary

7.17.4 Strategic Growth Plans

7.18 Western Digital Corporation

7.18.1 Business Overview

7.18.2 Product and Service Offerings

7.18.3 Key Financial Summary

7.18.4 Strategic Growth Plans

Chapter 8. Appendix

8.1 Abbreviations

8.2 Sources and References

8.3 Related Reports

LIST OF TABLES

TABLE 1 ANALYSIS PERIOD OF THE STUDY

TABLE 2 GLOBAL MEMORY PACKAGING MARKET, BY REGION, $M (2017E–2023)

TABLE 3 TECHNICAL IMPROVEMENTS IN WIRE BONDING

TABLE 4 APAC MEMORY PACKAGING MARKET, BY PLATFORM, $M (2017E–2023)

TABLE 5 APAC MEMORY PACKAGING MARKET, BY APPLICATION, $M (2017E–2023)

TABLE 6 APAC MEMORY PACKAGING MARKET, BY END-USE, $M (2017E–2023)

TABLE 7 APAC MEMORY PACKAGING MARKET, BY COUNTRY, $M (2017E–2023)

TABLE 8 APPLE INC. – AT A GLANCE

TABLE 9 APPLE INC. – KEY FINANCIAL SUMMARY

TABLE 10 DELL EMC – AT A GLANCE

TABLE 11 QUALCOMM TECHNOLOGIES INC. – AT A GLANCE

TABLE 12 QUALCOMM TECHNOLOGIES INC. – KEY FINANCIAL SUMMARY

TABLE 13 IBM CORPORATION– AT A GLANCE

TABLE 14 IBM CORPORATION– KEY FINANCIAL SUMMARY

TABLE 15 INTEL CORPORATION – AT A GLANCE

TABLE 16 INTEL CORPORATION – KEY FINANCIAL SUMMARY

TABLE 17 CISCO SYSTEMS – AT A GLANCE

TABLE 18 CISCO SYSTEMS – KEY FINANCIAL SUMMARY

TABLE 19 SAMSUNG ELECTRONICS – AT A GLANCE

TABLE 20 SAMSUNG ELECTRONICS – KEY FINANCIAL SUMMARY

TABLE 21 WINBOND ELECTRONICS – AT A GLANCE

TABLE 22 WINBOND ELECTRONICS – KEY FINANCIAL SUMMARY

TABLE 23 FUJITSU LIMITED – AT A GLANCE

TABLE 24 FUJITSU LIMITED – KEY FINANCIAL SUMMARY

TABLE 25 LG ELECTRONICS – AT A GLANCE

TABLE 26 LG ELECTRONICS – KEY FINANCIAL SUMMARY

TABLE 27 TOSHIBA CORPORATION – AT A GLANCE

TABLE 28 TOSHIBA CORPORATION – KEY FINANCIAL SUMMARY

TABLE 29 SK HYNIX – AT A GLANCE

TABLE 30 SK HYNIX – KEY FINANCIAL SUMMARY

TABLE 31 NANYA TECHNOLOGY CORPORATION – AT A GLANCE

TABLE 32 NANYA TECHNOLOGY CORPORATION – KEY FINANCIAL SUMMARY

TABLE 33 ASE GROUP – AT A GLANCE

TABLE 34 ASE GROUP – KEY FINANCIAL SUMMARY

TABLE 35 NEC CORPORATION – AT A GLANCE

TABLE 36 NEC CORPORATION – KEY FINANCIAL SUMMARY

TABLE 37 STMICROELECTRONICS – AT A GLANCE

TABLE 38 STMICROELECTRONICS – KEY FINANCIAL SUMMARY

TABLE 39 MICRON TECHNOLOGY – AT A GLANCE

TABLE 40 MICRON TECHNOLOGY– KEY FINANCIAL SUMMARY

TABLE 41 WESTERN DIGITAL CORPORATION – AT A GLANCE

TABLE 42 WESTERN DIGITAL CORPORATION – KEY FINANCIAL SUMMARY

LIST OF FIGURES

FIG 1 RESEARCH METHODOLOGY

FIG 2 BREAKDOWN OF PRIMARY RESEARCH BY INDUSTRY PARTICIPANT

FIG 3 BREAKDOWN OF PRIMARY RESEARCH BY COMPANY TYPE

FIG 4 DATA TRIANGULATION APPROACH

FIG 5 APAC MEMORY PACKAGING MARKET SUMMARY

FIG 6 ADVANCEMENTS IN MEMORY PACKAGING TECHNOLOGY

FIG 7 DRIVERS FOR THE MARKET: IMPACT ANALYSIS

FIG 8 RESTRAINTS FOR THE MARKET: IMPACT ANALYSIS

FIG 9 PORTER’S FIVE FORCES ANALYSIS

FIG 10 APAC MEMORY PACKAGING MARKET, BY PLATFORM, $M (2017E–2023)

FIG 11 APAC MEMORY PACKAGING MARKET, BY APPLICATION, $M (2017E–2023)

FIG 12 APAC MEMORY PACKAGING MARKET, BY END-USE, $M (2017E–2023)

FIG 13 APAC MEMORY PACKAGING MARKET, BY COUNTRY, $M (2017E–2023)

FIG 14 APPLE INC. – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2017)

FIG 15 QUALCOMM TECHNOLOGIES INC. – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2017)

FIG 16 IBM CORPORATION – REVENUE SPLIT BY REPORTABLE SEGMENT AND BY GEOGRAPHY (2017)

FIG 17 INTEL CORPORATION REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2016)

FIG 18 CISCO SYSTEMS – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2017)

FIG 19 SAMSUNG ELECTRONICS – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2017)

FIG 20 FUJITSU LIMITED – REVENUE SPLIT BY REPORTABLE SEGMENT AND BY GEOGRAPHY (2017)

FIG 21 LG ELECTRONICS – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2016)

FIG 22 TOSHIBA CORPORATION – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2017)

FIG 23 SK HYNIX – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2017)

FIG 24 ASE GROUP – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2017)

FIG 25 NEC CORPORATION – REVENUE SPLIT BY OPERATING SEGMENT (2017)

FIG 26 STMICROELECTRONICS – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2017)

FIG 27 MICRON TECHNOLOGY – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2016)

FIG 28 WESTERN DIGITAL CORPORATION – REVENUE SPLIT BY REPORTABLE SEGMENT AND GEOGRAPHY (2017)



*** レポートのキーワード ***

メモリ半導体パッケージング

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