半導体組立装置の世界市場

調査会社Technavio社が発行したリサーチレポート(データ管理コード:IRTNTR12767)
◆英語タイトル:Global Semiconductor Assembly Equipment Market 2017-2021
◆発行会社/調査会社:Technavio
◆商品コード:IRTNTR12767
◆発行日:2017年5月24日
◆調査対象地域:グローバル
◆産業分野:産業装置・機械
◆ページ数:70
◆レポート言語:英語
◆レポート形式:PDF
◆納品方式:Eメール(受注後24時間以内)
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当調査レポートでは、半導体組立装置の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、半導体組立装置の世界市場規模及び予測、種類別分析、需要先別分析、地域別分析/市場規模、主要国別分析、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。
*** レポート概要(サマリー)***

About Semiconductor Assembly EquipmentSemiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the back-end process of chip formation. Chip assembly basically involves attaching or joining two or more semiconductor wafers or semiconductor devices to increase the functionality of chips. Machinery is used for making interconnects between an IC or any other semiconductor device during assembly. This connection ensures the flow of electricity in the semiconductor device.

Technavio’s analysts forecast the global semiconductor assembly equipment market to grow at a CAGR of 3.57% during the period 2017-2021.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global semiconductor assembly equipment market for 2017-2021. To calculate the market size, the report considers the sales of assembly equipment to end-users.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Semiconductor Assembly Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• ASM Pacific Technology
• Kulicke & Soffa Industries
• Palomar Technologies
• Tokyo Electron
• Tokyo Seimitsu

[Other prominent vendors]
• Besi
• ChipMOS TECHNOLOGIES
• DIAS Automation
• Greatek Electronics
• Hesse Mechatronics
• Hybond
• Shinkawa
• Toray Engineering
• West•Bond

[Market driver]
• Incentives and discounts for long-term customers
• For a full, detailed list, view our report

[Market challenge]
• High-investment market
• For a full, detailed list, view our report

[Market trend]
• Growing use of 3D packaging technology
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

*** You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

*** レポート目次(コンテンツ)***

Table of Contents
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
• Key market highlights

PART 05: Technology overview
• Overview of semiconductor assembly equipment

PART 06: Market landscape
• Semiconductor assembly equipment market: Overview
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation by type
• Global semiconductor assembly equipment market by type
• Global semiconductor assembly equipment market by die bonding equipment
• Global semiconductor assembly equipment market by inspection and dicing equipment
• Global semiconductor assembly equipment market by packaging equipment
• Global semiconductor assembly equipment market by wire bonding equipment
• Global semiconductor assembly equipment market by plating equipment

PART 08: Market segmentation by end-user
• Global semiconductor assembly equipment market by end-user
• Global semiconductor assembly equipment market by OSATs
• Global semiconductor assembly equipment market by IDMs

PART 09: Geographical segmentation
• Global semiconductor assembly equipment market by geography
• Semiconductor assembly equipment market in APAC
• Semiconductor assembly equipment market in Americas
• Semiconductor assembly equipment market in EMEA

PART 10: Key leading countries
• Global semiconductor assembly market: Key leading countries
• Taiwan
• South Korea
• Japan
• China

PART 11: Decision framework

PART 12: Drivers and challenges
• Market drivers
• Impact of drivers on key customer segments
• Impact of drivers on key customer segments
• Market challenges
• Impact of challenges on key customer segments

PART 13: Market trends
• Growing use of 3D packaging technology
• Increase in number of OSAT vendors
• M&A in packaging and assembly market
• Advent of FOWLP technology
• Automation in automobiles
• Increased need for semiconductor memory devices

PART 14: Vendor landscape
• Competitive scenario
• Major vendors
• Other prominent vendors

PART 15: Appendix
• List of abbreviations

[List of Exhibits]
Exhibit 01: Steps in back-end chip formation
Exhibit 02: Supply chain in traditional semiconductor IC packaging industry
Exhibit 03: Supply chain in new semiconductor IC packaging industry
Exhibit 04: Global semiconductor assembly equipment market: Overview
Exhibit 05: Global semiconductor assembly equipment market 2016-2021 ($ billions)
Exhibit 06: Five forces analysis
Exhibit 07: Global semiconductor assembly equipment market by type 2016-2021 (% share)
Exhibit 08: Global semiconductor assembly equipment market by type: Revenue trend line 2016-2021 ($ billions)
Exhibit 09: Global semiconductor assembly equipment market by die bonding equipment 2016-2021 ($ billions)
Exhibit 10: Global semiconductor assembly equipment market by inspection and dicing equipment 2016-2021 ($ billions)
Exhibit 11: Global semiconductor assembly equipment market by packaging equipment 2016-2021 ($ billions)
Exhibit 12: Global semiconductor assembly equipment market by wire bonding equipment 2016-2021 ($ billions)
Exhibit 13: Global semiconductor assembly equipment market plating equipment 2016-2021 ($ billions)
Exhibit 14: Global semiconductor assembly equipment market by end-user 2016-2021 (% share)
Exhibit 15: Global semiconductor assembly equipment market by end-user: Revenue trend line 2016-2021 ($ billions)
Exhibit 16: Global semiconductor assembly equipment market by OSATs 2016-2021 ($ billions)
Exhibit 17: Global semiconductor assembly equipment market by IDMs 2016-2021 ($ billions)
Exhibit 18: Global semiconductor assembly equipment by geography 2016-2021 (% share)
Exhibit 19: Global semiconductor assembly equipment market by geography: Revenue trend line 2016-2021 ($ billions)
Exhibit 20: Semiconductor assembly equipment market in APAC 2016-2021 ($ billions)
Exhibit 21: Semiconductor assembly equipment market in Americas 2016-2021 ($ billions)
Exhibit 22: Semiconductor assembly equipment market in EMEA 2016-2021 ($ millions)
Exhibit 23: Key leading countries
Exhibit 24: Global semiconductor assembly market: Key leading countries 2016-2021
Exhibit 25: Semiconductor devices by application 2016 and 2021 (% share)
Exhibit 26: Impact of drivers
Exhibit 27: Impact of drivers
Exhibit 28: Global semiconductor market trend 1992-2016 ($ billions)
Exhibit 29: Impact of challenges
Exhibit 30: CAGR of 3D NAND and DRAM 2016-2021
Exhibit 31: Global semiconductor assembly equipment market: Other prominent vendors



*** 掲載企業 ***

ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron, Tokyo Seimitsu, Besi, ChipMOS TECHNOLOGIES, DIAS Automation, Greatek Electronics, Hesse Mechatronics, Hybond, Shinkawa, Toray Engineering, and West Bond.

*** レポートのキーワード ***

半導体組立装置、半導体アセンブリ装置

*** 調査方法 ***

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

*** 免責事項 ***
https://www.globalresearch.co.jp/disclaimer/


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