半導体ウエハー検査装置の世界市場2019-2023

調査会社Technavio社が発行したリサーチレポート(データ管理コード:IRTNTR30510)
◆英語タイトル:Global Semiconductor Wafer Inspection Equipment Market 2019-2023
◆発行会社/調査会社:Technavio
◆商品コード:IRTNTR30510
◆発行日:2018年12月14日
◆調査対象地域:グローバル、アジア、北米、ヨーロッパ(EMEA)
◆産業分野:電子
◆ページ数:128
◆レポート言語:英語
◆レポート形式:PDF
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当調査レポートでは、半導体ウエハー検査装置の世界市場について調査・分析し、市場概要、市場環境、半導体ウエハー検査装置市場規模、技術別(光学式ウエハー検査、電子ビームウエハー検査)分析、エンドユーザー別(半導体製造工場、IDM)分析、市場動向、競争環境、主要地域別市場規模(北米、ヨーロッパ、アジアなど)、関連企業情報などを含め、以下の構成でお届け致します。
・エグゼクティブサマリー
・調査範囲・調査手法
・半導体ウエハー検査装置の世界市場概要
・半導体ウエハー検査装置の世界市場環境
・半導体ウエハー検査装置の世界市場動向
・半導体ウエハー検査装置の世界市場規模
・半導体ウエハー検査装置の世界市場:業界構造分析
・半導体ウエハー検査装置の世界市場:技術別(光学式ウエハー検査、電子ビームウエハー検査)
・半導体ウエハー検査装置の世界市場:エンドユーザー別(半導体製造工場、IDM)
・半導体ウエハー検査装置の世界市場:地域別市場規模・分析
・半導体ウエハー検査装置の北米市場規模・予測
・半導体ウエハー検査装置のヨーロッパ・中東・アフリカ市場規模・予測
・半導体ウエハー検査装置のアジア太平洋市場規模・予測
・半導体ウエハー検査装置の主要国分析
・半導体ウエハー検査装置の世界市場:意思決定フレームワーク
・半導体ウエハー検査装置の世界市場:成長要因、課題
・半導体ウエハー検査装置の世界市場:競争環境
・半導体ウエハー検査装置の世界市場:関連企業情報(ベンダー分析)

主な分析対象企業は、Applied Materials、ASML、Hitachi High-Technologies、KLA-Tencor、Rudolph Technologiesなどです。
*** レポート概要(サマリー)***

About this market
The growing investments in lower technology node to drive growth in the market. Semiconductor industries and IDMs are investing heavily on R&D to identify new technologies that can support the production of smaller process nodes. Technavio’s analysts have predicted that the semiconductor wafer inspection equipment market will register a CAGR of more than 6% by 2023.
Market Overview
Increasing number of data centers
With an increasing number of data centers, there has been a rising demand for semiconductor components. Semiconductors are an integral part of data centers, which have thousands of servers and each server runs with the help of semiconductor ICs.
Complexity of technological transitions
A major challenge hindering growth of the global semiconductor wafer inspection equipment market is the complexity of technological transitions that are occurring across the semiconductor industry.
For the detailed list of factors that will drive and challenge the growth of the semiconductor wafer inspection equipment market during the 2019-2023, view our report.
Competitive Landscape
The market appears to be fragmented and with the presence of several companies including Applied Materials and ASML the competitive environment is quite intense. Factors such as the growing investments in lower technology node and the increasing number of data centers, will provide considerable growth opportunities to semiconductor wafer inspection equipment manufactures. Applied Materials, ASML, Hitachi High-Technologies, KLA-Tencor, and Rudolph Technologies are some of the major companies covered in this report.

*** レポート目次(コンテンツ)***

PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: MARKET LANDSCAPE
• Market ecosystem
• Market segmentation analysis
• Market characteristics
PART 04: MARKET SIZING
• Market definition
• Market sizing 2018
• Market size and forecast 2018-2023
PART 05: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 06: MARKET SEGMENTATION BY TECHNOLOGY
• Market segmentation by technology
• Comparison by technology
• Optical wafer inspection – Market size and forecast 2018-2023
• E-beam wafer inspection – Market size and forecast 2018-2023
• Market opportunity by technology
PART 07: CUSTOMER LANDSCAPE
PART 08: MARKET SEGMENTATION BY END-USER
• Market segmentation by end-user
• Comparison by end-user
• Foundries – Market size and forecast 2018-2023
• IDMs – Market size and forecast 2018-2023
• Market opportunity by end-user
PART 09: GEOGRAPHIC LANDSCAPE
• Geographic segmentation
• Geographic comparison
• APAC – Market size and forecast 2018-2023
• Americas – Market size and forecast 2018-2023
• EMEA – Market size and forecast 2018-2023
• Key leading countries
• Market opportunity
PART 10: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
• Increasing focus on large diameter wafer size
• Growing investments in lower technology node
• Growing investment in 3D NAND and FinFET technologies
PART 11: VENDOR LANDSCAPE
• Overview
• Landscape disruption
• Competitive scenario
PART 12: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Applied Materials
• ASML
• Hitachi High-Technologies
• KLA-Tencor
• Rudolph Technologies
PART 13: APPENDIX
• Research methodology
• List of abbreviations


Exhibit 01: Preface
Exhibit 02: Preface
Exhibit 03: Global semiconductor capital equipment market
Exhibit 04: Segments of global semiconductor capital equipment market
Exhibit 05: Market segments
Exhibit 06: Market characteristics
Exhibit 07: Market definition – Inclusions and exclusions checklist
Exhibit 08: Market size 2018
Exhibit 09: Global market: Size and forecast 2018-2023 ($ millions)
Exhibit 10: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 11: Five forces analysis 2018
Exhibit 12: Five forces analysis 2023
Exhibit 13: Bargaining power of buyers
Exhibit 14: Bargaining power of suppliers
Exhibit 15: Threat of new entrants
Exhibit 16: Threat of substitutes
Exhibit 17: Threat of rivalry
Exhibit 18: Market condition – Five forces 2018
Exhibit 19: Technology – Market share 2018-2023 (%)
Exhibit 20: Comparison by technology
Exhibit 21: Optical wafer inspection – Market size and forecast 2018-2023 ($ millions)
Exhibit 22: Optical wafer inspection – Year-over-year growth 2019-2023 (%)
Exhibit 23: E-beam wafer inspection – Market size and forecast 2018-2023 ($ millions)
Exhibit 24: E-beam wafer inspection – Year-over-year growth 2019-2023 (%)
Exhibit 25: Market opportunity by technology
Exhibit 26: Customer landscape
Exhibit 27: End-user – Market share 2018-2023 (%)
Exhibit 28: Comparison by end-user
Exhibit 29: Foundries – Market size and forecast 2018-2023 ($ millions)
Exhibit 30: Foundries – Year-over-year growth 2019-2023 (%)
Exhibit 31: IDMs – Market size and forecast 2018-2023 ($ millions)
Exhibit 32: IDMs – Year-over-year growth 2019-2023 (%)
Exhibit 33: Market opportunity by end-user
Exhibit 34: Market share by geography 2018-2023 (%)
Exhibit 35: Geographic comparison
Exhibit 36: Major semiconductor foundries in APAC
Exhibit 37: APAC – Market size and forecast 2018-2023 ($ millions)
Exhibit 38: APAC – Year-over-year growth 2019-2023 (%)
Exhibit 39: Americas – Market size and forecast 2018-2023 ($ millions)
Exhibit 40: Americas – Year-over-year growth 2019-2023 (%)
Exhibit 41: Major foundries in EMEA
Exhibit 42: EMEA – Market size and forecast 2018-2023 ($ millions)
Exhibit 43: EMEA – Year-over-year growth 2019-2023 (%)
Exhibit 44: Key leading countries
Exhibit 45: Market opportunity
Exhibit 46: Decision framework
Exhibit 47: Impact of drivers and challenges
Exhibit 48: Vendor landscape
Exhibit 49: Landscape disruption
Exhibit 50: Vendors covered
Exhibit 51: Vendor classification
Exhibit 52: Market positioning of vendors
Exhibit 53: Applied Materials – Vendor overview
Exhibit 54: Applied Materials – Business segments
Exhibit 55: Applied Materials – Organizational developments
Exhibit 56: Applied Materials – Geographic focus
Exhibit 57: Applied Materials – Segment focus
Exhibit 58: Applied Materials – Key offerings
Exhibit 59: ASML – Vendor overview
Exhibit 60: ASML – Organizational developments
Exhibit 61: ASML – Geographic focus
Exhibit 62: ASML – Key offerings
Exhibit 63: Hitachi High-Technologies – Vendor overview
Exhibit 64: Hitachi High-Technologies – Business segments
Exhibit 65: Hitachi High-Technologies – Organizational developments
Exhibit 66: Hitachi High-Technologies – Segment focus
Exhibit 67: Hitachi High-Technologies – Key offerings
Exhibit 68: KLA-Tencor – Vendor overview
Exhibit 69: KLA-Tencor – Organizational developments
Exhibit 70: KLA-Tencor – Geographic focus
Exhibit 71: KLA-Tencor – Key offerings
Exhibit 72: Rudolph Technologies – Vendor overview
Exhibit 73: Rudolph Technologies – Organizational developments
Exhibit 74: Rudolph Technologies – Geographic focus
Exhibit 75: Rudolph Technologies – Key offerings
Exhibit 76: Validation techniques employed for market sizing
Exhibit 77: List of abbreviations



*** 掲載企業 ***

Applied Materials、ASML、Hitachi High-Technologies、KLA-Tencor、Rudolph Technologies

*** 免責事項 ***
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