成形回路部品(MID)の世界市場予測(~2023年):LDS、二個取り成形、フィルム技術

◆英語タイトル:Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023
◆発行会社/調査会社:MarketsandMarkets
◆商品コード:SE-6567
◆発行日:2018年8月31日
◆調査対象地域:グローバル
◆産業分野:半導体・エレクトロニクス
◆ページ数:92
◆レポート言語:英語
◆レポート形式:PDF
◆納品方式:Eメール(受注後24時間以内)
◆販売価格オプション(消費税別)
Single User(1名利用)USD5,650 ⇒換算¥621,500見積依頼/購入/質問フォーム
Multi User (Five User)USD6,650 ⇒換算¥731,500見積依頼/購入/質問フォーム
Corporate License (全社内共有可)USD8,150 ⇒換算¥896,500見積依頼/購入/質問フォーム
販売価格オプションの説明はこちらで、ご購入に関する詳細案内はご利用ガイドでご確認いただけます。
※お支払金額は「換算金額(日本円)+消費税+配送料(Eメール納品は無料)」です。
※本体価格が¥30,000未満のレポートにつきましては、ハンドリングチャージ¥5,000が別途かかります。
※Eメールによる納品の場合、通常ご注文当日~2日以内に納品致します。
※レポート納品後、納品日+5日以内に請求書を発行し、お客様宛に郵送いたしますので、請求書発行日より2ヶ月以内に銀行振込にて支払をお願いします。(振込先:三菱UFJ銀行/京橋支店/H&Iグローバルリサーチ株式会社)
MarketsandMarkets社の概要及び新刊レポートはこちらでご確認いただけます。

★グローバルリサーチ資料[成形回路部品(MID)の世界市場予測(~2023年):LDS、二個取り成形、フィルム技術]についてメールでお問い合わせはこちら
MarketsandMarketsが発行した当調査レポートでは、成形回路部品(MID)の世界市場について調査・分析し、エグゼクティブサマリー、市場インサイト、市場概観/市場動向、産業動向、プロセス別(LDS、二個取り成形、フィルム技術)分析、製品別(アンテナ・接続モジュール、コネクター・スイッチ、センサー、照明)分析、産業別分析、成形回路部品(MID)の世界市場規模及び予測、市場動向、競争状況、関連企業分析などの情報をお届けいたします。
*** レポート概要(サマリー)***

The MID market is expected to reach USD 1,798.3 million by 2023 from USD 894.1 million in 2018, at a CAGR of 15.0% from 2018 to 2023. Major factors driving the growth of this market include the increasing use of MID in medical devices, rising demand for miniaturization in the consumer electronics industry, and growing need to reduce e-waste. For the past few years, the healthcare industry has been focusing on minimizing its spending on medical devices and equipment, as well as adopting the latest technologies (with fast operations and miniaturized components compared with the existing ones). Designing miniaturized and portable equipment requires miniaturized components. MID technology meets these requirements of medical device OEMs.
In this report, the MID market has been segmented based on process, product type, industry, and geography. The consumer electronics industry accounted for the largest share of the MID market in 2017. MIDs are used in consumer electronics for the internal antenna of cellular phones, which replaces the normal antenna stub. Furthermore, using antenna as part of the phone’s internal fixtures helps in reducing volume by achieving more efficient space utilization. Therefore, growth in smartphones, tablets, and laptops would increase the adoption of MIDs in this industry, which would further fuel the growth of the MID market in the coming years.

The market for laser direct structuring is expected to grow at the highest CAGR during the forecast period. LDS equipment is used to manufacture MIDs. LDS consists of various steps, such as injection molding, laser activation, metallization, and assembly. LPKF is the sole manufacturer of LDS equipment. It allows to eliminate components in electronic devices, such as antennae in smartphones, thus reducing assembly time and device production cost. Moreover, the introduction of 5G mobile communications technology will lead to the rise in demand for smartphone antennae, which in turn will increase demand for LDS equipment.

By region, the MID market has been segmented into North America, Europe, APAC, and RoW. APAC is expected to account for the largest size of the overall MID market during the forecast period. APAC is expected to offer lucrative opportunities for the MID market growth owing to the growing base for communication infrastructure, communication devices, and consumer electronics. APAC is one of the key regions for players dealing with smartphones and wearable devices. The trend of miniaturization of components in smartphones and wearables will drive the MID market in this region.

Automotive
MIDs have a thriving market in the automotive industry. This is largely due to the wide-scale adoption of MID in various automotive applications, such as steering wheel hubs, brake sensors, position sensors, and lighting. In automotive, MID reduces the wiring and combines the connector and housing in 1 piece, and through selective plating, it incorporates all the required circuitry. Such benefits of MIDs encourage this industry to adopt MID technology, thereby fueling the MID marke

MIDs are used in consumer electronics for the internal antenna of cellular phones, which replaces the normal antenna stub. Furthermore, using antenna as part of the phone’s internal fixtures helps in reducing volume by achieving more efficient space utilization. Therefore, growth in smartphones, tablets, and laptops would increase the adoption of MIDs in this industry, which would further fuel the growth of the MID market in the coming years.

Telecommunications
To save production costs and reduce production time for devices, telecommunications equipment manufacturers are focusing on developing products where electrical and mechanical functions can be combined in a single product. In telecommunications, MID finds application in connectors, security shields, and telecommunications boxes, among others. Therefore, increase in the usage of MID in telecommunications applications would drive the MID market in the coming years.

Medical
The medical industry is implementing and adopting new technologies to provide better services to patients. MID technology has been used in medical devices to improve product quality. MID finds application in portable devices such as glucose meters and hearing aids. MID helps miniaturize monitoring devices for medication, which improves their diagnostic capabilities. Therefore, the increasing adoption of MID in medical devices is expected to boost the MID market growth in the coming years.

Critical questions that the report answers:
Where will all these developments take the industry in the mid to long term?
Will the suppliers continue to explore new avenues for MID?
What are the upcoming industrial applications for MID?
MID technology is incompatible with modern area-array based electronic packages. Electronic packages need multilayer structure for the routing of high-count I/O devices, which is not possible using MID. MIDs have only one electrical layer. Hence, due to the lack of multilayer structure, MID is incompatible with electronic packages. To overcome this limitation, manufacturers are working on developing a compatible fine-pitch multilayer process.

The key players operating in the MID market are Molex (US), LPKF (Germany), TE Connectivity (Switzerland), HARTING (Germany), APC (US), JOHNAN (Japan), MID Solutions (Germany), 2E mechatronic (Germany), and Multiple Dimensions (Switzerland).

*** レポート目次(コンテンツ)***

Table of Contents

1 Introduction (Page No. – 12)
1.1 Study Objectives
1.2 Definition
1.3 Study Scope
1.3.1 Years Considered for Study
1.4 Currency
1.5 Stakeholders

2 Research Methodology (Page No. – 15)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Breakdown of Primaries
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.2 Top-Down Approach
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions

3 Executive Summary (Page No. – 23)

4 Premium Insight (Page No. – 27)
4.1 Attractive Opportunities for Molded Interconnect Device Market Growth
4.2 Molded Interconnect Device Market for Consumer Electronics Industry, By Product Type
4.3 Molded Interconnect Device Market for Antennae and Connectivity Modules, By Industry
4.4 Molded Interconnect Device Market in Europe, By Process
4.5 Molded Interconnect Device Market, By Region

5 Market Overview (Page No. – 31)
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 Increasing Use of MID in Medical Devices
5.2.1.2 Rising Demand for Miniaturization in Consumer Electronics Industry
5.2.1.3 Increasing Need to Reduce E-Waste
5.2.2 Restraints
5.2.2.1 Technological Monopoly of Lds Equipment Manufacturer
5.2.3 Opportunities
5.2.3.1 Rising Use of MID in Automotive Industry
5.2.3.2 Growth in IoT Devices
5.2.4 Challenges
5.2.4.1 Incompatibility With Electronic Packages

6 Industry Trends (Page No. – 34)
6.1 Introduction
6.2 In-Mold Electronics (IME)
6.2.1 Applications
6.2.2 Building Blocks

7 Molded Interconnect Device Market, By Process (Page No. – 35)
7.1 Introduction
7.2 Laser Direct Structuring
7.3 2-Shot Molding
7.4 Film Techniques

8 Molded Interconnect Device Market, By Product Type (Page No. – 37)
8.1 Introduction
8.2 Antennae and Connectivity Modules
8.3 Sensors
8.4 Connectors and Switches
8.5 Lighting
8.6 Others

9 Molded Interconnect Device Market, By Industry (Page No. – 42)
9.1 Introduction
9.2 Telecommunications
9.3 Consumer Electronics
9.4 Automotive
9.5 Medical
9.6 Industrial

10 Geographic Analysis (Page No. – 48)
10.1 Introduction
10.2 North America
10.2.1 US
10.2.2 Canada
10.3 Europe
10.3.1 Germany
10.3.2 Switzerland
10.3.3 France
10.3.4 Rest of Europe
10.4 Asia Pacific (APAC)
10.4.1 China
10.4.2 Japan
10.4.3 South Korea
10.4.4 Rest of APAC
10.5 Rest of the World (RoW)
10.5.1 South America
10.5.2 Middle East and Africa

11 Competitive Landscape (Page No. – 62)
11.1 Introduction
11.2 Market Player Ranking Analysis
11.3 Competitive Situations and Trends
11.3.1 Expansions
11.3.2 Merger and Acquisitions
11.3.3 Product Development
11.3.4 Agreement

12 Company Profiles (Page No. – 66)
12.1 Introduction
12.2 Key Players
(Business Overview, Products Offered, Recent Developments, MnM View, SWOT Analysis)*
12.2.1 Molex
12.2.2 LPKF Laser & Electronics
12.2.3 TE Connectivity
12.2.4 HARTING
12.2.5 Arlington Plating Company
12.2.6 JOHNAN
12.2.7 MID Solutions
12.2.8 2E Mechatronic
12.2.9 Multiple Dimensions
*Business Overview, Products Offered, Recent Developments, MnM View, SWOT Analysis Might Not Be Captured in Case of Unlisted Companies.
12.3 Other Important Players
12.3.1 Laser Micronics
12.3.2 Teprosa
12.3.3 Axon Cable
12.3.4 S2P
12.3.5 Suzhou Cicor Technology Co. Ltd
12.3.6 IME Vendors
12.3.6.1 Dowdupont
12.3.6.2 Tactotek
12.3.6.3 Dura Tech Industries
12.3.6.4 Tekra
12.3.6.5 Yomura Technologies

13 Appendix (Page No. – 85)
13.1 Insights of Industry Experts
13.2 Discussion Guide
13.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
13.4 Available Customizations
13.5 Related Reports
13.6 Author Details

List of Tables (31 Tables)

Table 1 Molded Interconnect Device Market, By Process, 2015–2023 (USD Million)
Table 2 Molded Interconnect Device Market, By Product Type, 2015–2023 (USD Million)
Table 3 Molded Interconnect Device Market for Antennae and Connectivity Modules, By Industry, 2015–2023 (USD Million)
Table 4 Molded Interconnect Device Market for Sensors, By Industry, 2015–2023 (USD Million)
Table 5 Molded Interconnect Device Market for Connectors and Switches, By Industry, 2015–2023 (USD Million)
Table 6 Molded Interconnect Device Market for Lighting, By Industry, 2015–2023 (USD Million)
Table 7 Molded Interconnect Device Market for Others, By Industry, 2015–2023 (USD Million)
Table 8 Molded Interconnect Device Market, By Industry, 2015–2023 (USD Million)
Table 9 Molded Interconnect Device Market for Telecommunications, By Product Type, 2015–2023 (USD Million)
Table 10 Molded Interconnect Device Market for Consumer Electronics, By Product Type, 2015–2023 (USD Million)
Table 11 Molded Interconnect Device Market for Automotive, By Product Type, 2015–2023 (USD Million)
Table 12 Molded Interconnect Device Market for Medical, By Product Type, 2015–2023 (USD Million)
Table 13 Molded Interconnect Device Market for Industrial, By Product Type, 2015–2023 (USD Million)
Table 14 Molded Interconnect Device Market, By Region, 2015–2023 (USD Million)
Table 15 Molded Interconnect Device Market in North America, By Country, 2015–2023 (USD Million)
Table 16 Molded Interconnect Device Market in North America, By Process, 2015–2023 (USD Million)
Table 17 Molded Interconnect Device Market in North America, By Industry, 2015–2023 (USD Million)
Table 18 Molded Interconnect Device Market in Europe, By Country, 2015–2023 (USD Million)
Table 19 Molded Interconnect Device Market in Europe, By Process, 2015–2023 (USD Million)
Table 20 Molded Interconnect Device Market in Europe, By Industry, 2015–2023 (USD Million)
Table 21 Molded Interconnect Device Market in APAC, By Country, 2015–2023 (USD Million)
Table 22 Molded Interconnect Device Market in APAC, By Process, 2015–2023 (USD Million)
Table 23 Molded Interconnect Device Market in APAC, By Industry, 2015–2023 (USD Million)
Table 24 Molded Interconnect Device Market in RoW, By Region, 2015–2023 (USD Million)
Table 25 Molded Interconnect Device Market in RoW, By Process, 2015–2023 (USD Million)
Table 26 Molded Interconnect Device Market in RoW, By Industry, 2015–2023 (USD Million)
Table 27 Ranking of Key Players in Molded Interconnect Device Market (2017)
Table 28 Expansions 2017–2018
Table 29 Merger and Acquisitions, 2015–2017
Table 30 Product Development, 2017
Table 31 Agreement, 2017

List of Figures (24 Figures)

Figure 1 Molded Interconnect Device Market Segmentation
Figure 2 Molded Interconnect Devices Market: Report Design
Figure 3 Process Flow
Figure 4 Market Size Estimation Methodology: Bottom-Up Approach
Figure 5 Market Size Estimation Methodology: Top-Down Approach
Figure 6 Data Triangulation
Figure 7 Assumptions for Research Study
Figure 8 Laser Direct Structuring to Lead Molded Interconnect Device Market During Forecast Period
Figure 9 Antennae and Connectivity Modules to Hold Largest Size of Molded Interconnect Device Market By 2023
Figure 10 Molded Interconnect Device Market for Automotive to Grow at Highest CAGR During Forecast Period
Figure 11 Molded Interconnect Device Market to Grow at Highest CAGR in Germany During Forecast Period
Figure 12 Increasing Use of Molded Interconnect Devices in Automotive Industry to Offer Opportunities for Market Growth
Figure 13 Antennae and Connectivity Modules to Lead Molded Interconnect Device Market for Consumer Electronics During Forecast Period
Figure 14 Automotive to Grow at Highest CAGR During Forecast Period
Figure 15 Laser Direct Structuring Held Largest Share of Molded Interconnect Device Market in Europe in 2017
Figure 16 Molded Interconnect Device Market to Grow at Highest CAGR in Europe From 2018 to 2023
Figure 17 Rising Demand for Miniaturization in Consumer Electronics Industry Driving the MID Market
Figure 18 Molded Interconnect Device Market: Geographic Snapshot
Figure 19 Molded Interconnect Device Market Snapshot: North America
Figure 20 Molded Interconnect Device Market Snapshot: Europe
Figure 21 Molded Interconnect Device Market Snapshot: APAC
Figure 22 Companies Adopted Expansion as Key Growth Strategy During 2016–2018
Figure 23 LPKF: Company Snapshot
Figure 24 TE Connectivity: Company Snapshot

*** 免責事項 ***
https://www.globalresearch.co.jp/disclaimer/


※おすすめ調査資料
※当サイト上のレポートデータは弊社H&Iグローバルリサーチ運営のMarketReport.jpサイトと連動しています。
※当市場調査資料(SE-6567 )"成形回路部品(MID)の世界市場予測(~2023年):LDS、二個取り成形、フィルム技術" (英文:Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023)はMarketsandMarkets社が調査・発行しており、H&Iグローバルリサーチが販売します。


◆H&Iグローバルリサーチのお客様(例)◆


※当サイトに掲載していない調査資料も弊社を通してご購入可能ですので、お気軽にご連絡ください。ウェブサイトでは紹介しきれない資料も数多くございます。
※H&Iグローバルリサーチ(登録第5864124号)及びH&I(登録第5783645号)はH&Iグローバルリサーチ株式会社の商標です。